SKD Interactive Display Breakdown

SKD Interactive Display Breakdown – Shenzhen Fangcheng Tech Co., Ltd.

The SKD Interactive Display (Semi-Knock-Down) approach simplifies the assembly process by shipping partially assembled components of interactive displays. It balances cost-efficiency with ease of final assembly, focusing on pre-assembled modules that reduce complexity and assembly time. This method is ideal for distributors or manufacturers with limited assembly capabilities, ensuring quicker production timelines while maintaining customization flexibility.

SKD Parts and Assembly Process

  • Install the Light Bar: Place the light bar on the back panel.
  • Cover with Paper: Add a protective paper layer over the light bar.
  • Add the DOP Screen: Position the DOP screen on top of the paper layer.
  • Insert the Optical Diffuser: Place the optical diffuser for uniform light distribution.
  • Install the LCD Screen: Attach the LCD screen as the main display component.
  • Assemble the Front Frame:
    • Attach the front frame.
    • Ensure the IR sensors are integrated into the frame.
  • Connect PCB and Other Components:
    • Connect the PCB motherboard.
    • Install the power board.
    • Add necessary wiring.
    • Attach the protective cover for secure assembly.

Frame with Touch Module

  • Touchscreen Glass: Pre-installed with infrared or capacitive touch technology. The interactive flat panel is partially disassembled, and major sub-assemblies are shipped together. For example, the Frame with Touch Module might be partially assembled, such as having the touchscreen glass and the protective frame already integrated with the touch sensor controller, but not yet connected to other components like cables or the motherboard.
  • Protective Frame: Delivered as a single unit with the integrated touch sensor controller attached.

Let’s breakdown how the fully OC screen is built.

Backlight with OC Module and Touch Frame

Frame Types for SKD OC Part

For the SKD OC part, specifically the screen component, we have three types of frames: OD18, OD19, and OD35.

  • OD35: Deeper frame allowing for the inclusion of larger, more affordable materials, which leads to a decrease in quality.
  • OD18: Represents advanced technology with new microchips, making it more expensive.

Layer Construction

  1. First Layer: Frame
    • The first layer of the screen is the frame.
  2. LED Layer
    • We use three types of LEDs: 1W, 2W, and 3W, depending on the power required.
    • Brightness depends on the power and the quantity of LEDs used.
  3. Diaphragm Layers
    • Types of Diaphragms: First diaphragm, DOP diaphragm, and another diaphragm.
    • After assembling these layers, two additional diaphragms are installed in a no-dust room to ensure cleanliness.

PCB and T-Con Connectivity

  • The screen includes attached PCB (Printed Circuit Board) connected to the T-Con (Timing Controller).
  • The T-Con board is connected with two cables:
    • Connects the left and right sides of the screen to the logic board.
    • The logic board (T-Con board) connects OC with Android motherboard.

Final Assembly with Touch Frame

  • LCD Screen Frame
    • Equipped with an anti-glare coating (single-sided or double-sided as required).
    • Includes infrared sensors installed on all four sides for touch functionality.

Motherboard (Mainboard):

  • Mounted Processor (CPU and GPU): Fully installed with RAM and ROM on the PCB, allowing for plug-and-play operation without requiring additional configuration.
  • Pre-mounted Port Connectors: HDMI, USB, and LAN connectors are already installed for plug-and-play functionality.
  • Static Shield: The static shield is already attached to the PCB for additional protection during shipment and handling.

Processor Components Overview

Main Component: Android Motherboard

The processor part is divided into several components, with the Android motherboard as the main component.

  • Types of motherboards:
    • 311D2
    • 9679
    • T982
    • V100

Additional Components

  1. Power Board
    • Distributes power to the screen, motherboard, and and other PCB boards, and to speakers.
  2. Logic Board
    • Supports overall functionality and connectivity between OC and Motherboard.
  3. External Port Board
    • Facilitates external device connections.
  4. Speakers
    • Integrated for audio output.
  5. Cables
    • Ensures all components are interconnected.

PCB for OPS Connection

  • An additional PCB acts as a converter, connecting the OPS (Open Pluggable Specification) to the Android motherboard.

Internal Connectivity

  • All components are internally connected to ensure seamless functionality.

Housing (Casing):

  • Assembled Rear Cover: Delivered as a pre-configured module with all cooling components (fans and heat sinks) installed, reducing the amount of assembly required.
  • Front Frame: Pre-attached with alignment guides for quicker assembly. The front frame is designed for easy integration into the final product
  • Mounting Bracket Nests: Integrated into the casing design.

Cables and Connectors:

  • Pre-Routed Cables: Ribbon cables, power cables, and signal wires are pre-installed and labeled for quick setup during final assembly.
  • Modular USB Boards: Pre-integrated with labeled ports, these boards are ready to be connected without additional wiring during assembly.

Audio and Connectivity Modules

  • Integrated Speakers: Speakers are integrated into the casing and pre-tested to ensure functionality.
  • Optional Wi-Fi and Antenna Modules: Pre-connected and ready for use during the final assembly.
  • Camera and Microphones: Pre-installed in designated slots within the casing for quick installation.

Power Supply Unit:

  • Internal Power Modules: Securely mounted, reducing the amount of assembly required.
  • Voltage Regulators: Pre-configured within the power unit for immediate use.

Control Buttons and Sensors:

  • Pre-Assembled Control Buttons: Fully connected and labeled for operational clarity during final assembly.
  • Integrated Sensors: Ambient light and proximity sensors are already built into the frame, reducing setup time.

Fasteners:

  • Minimal Assembly Kit: Includes additional screws or clips for final adjustments. Includes only the additional screws or clips for final adjustments.

Software & Firmware:

  • Pre-Installed Firmware: Drivers and the operating system are loaded directly onto the motherboard, requiring minimal configuration during final deployment.
  • Plug-and-Play Setup: Minimal software configuration required during deployment.

Packaging & Accessories of SKD Interactive Display

  • User Manuals and Assembly Guides: Customized for the SKD format, these guides help distributors or assembly teams quickly complete the setup.
  • Remote Control and Accessories: Pre-packed with batteries and protective covers, ready for inclusion in the final assembly.
  • Optional Styluses or Pens: Ready-to-use accessories included in the packaging.

Testing and Calibration Tools (Optional):

  • Pre-Calibrated Modules: These modules ensure functionality out-of-the-box, reducing setup time.
  • Optional Calibration Tools: Supplied for additional on-site adjustments if required.

This SKD Interactive Display (Semi-Knock-Down) breakdown streamlines the supply chain by providing partially assembled components, enabling faster deployment and reducing the need for specialized assembly expertise. This model supports distributors and manufacturers in delivering high-quality interactive displays with reduced production overhead.

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